A hybrid inverse method for evaluating FC-PBGA material response to thermal cycles

This study proposes a hybrid experimental-analytical inverse method that can be used to evaluate thermomechanical cyclic behavior of flip-chip plastic ball grid array modules and the constituent materials. Treating such a package as an adhesively bonded trilayer plate, the structural formulation follows and modifies an existing analytical model. A phase-shifted shadow moiré method is employed to obtain the package thermal warpage variation in responding to a temperature cycle. By correlating the modeling predicted and the experimentally measured package warpage, the application of the method leads to the determination of those uncertain material parameters including temperature dependent modulus of elasticity and coefficient of thermal expansion of the die attachment and the substrate materials. These parameters are difficult to determine otherwise due to the complexity involving the effect of package processing condition and extremely thin thickness of the adhesive layer. As the values of all material parameters are ascertained, shear and peel stresses in the module adhesive layer can also be evaluated based on the analytical model.