Electrical Resistance Modeling of Shape Memory Alloy Wire Using an Efficient Performance Analysis Approach

This study describes a new method for modeling the electric resistance of Shape Memory Alloy wires (SMA). In order to account for the shape memory effect, wire- and spring-based devices have recently been employed in the design of actuators for displacement control. Because of its nonlinear characteristics, understanding the change in resistance over temperature and time is important in control system design. As a result, additional experiments and modeling are needed to determine the major influence of temperature fluctuation from ambient to transformation temperature in the thermal cycle, which is currently unexplored in the literature. The primary goal of this study is to find the optimum SMA wire for the tactile device under development. In terms of length, diameter changes, and stress impact, a comprehensive parametric analysis of the selected sample was performed. Furthermore, the novel approaches for determining resistance value over temperature-dependent stress fluctuation improve the displacement control strategy. The outcomes of the confirmed experiments and simulations are shown to be superior to the present method.