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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 7/2015

01.07.2015 | Review

Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years

verfasst von: Chong Leong Gan, U. Hashim

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 7/2015

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Abstract

The objective of this review is to study the evolution and key findings and critical technical challenges, solutions and future trend of bonding wires used in semiconductor electronics. Evolutions of bonding wires from Au to Cu and till the most recent silver (Ag) wire (perspective over 25 years packaging technology) have been discussed in this paper. The reliability performances of Au wire bonding, technical barriers of Cu wire bonding and corrosion mechanisms of Cu ball bonds are analyzed and covered. We focus on the influence of a variety of factors that have been reported recently, including reliability performance, wear out reliability performance that determine the selection of bonding wires to reach for developing high reliability of bonded devices. In the end of this review, the evolutions and future trends of bonding wires are compared and illustrated, which have marked effect based on the materials properties as well as reliability of wire types.
Vorheriger Artikel Present status of Sn–Zn lead-free solders bearing alloying elements
Nächster Artikel Progress on the fabrication of lead-free textured piezoelectric ceramics: perspectives over 25 years

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Metadaten
Titel
Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years
verfasst von
Chong Leong Gan
U. Hashim
Publikationsdatum
01.07.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 7/2015
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-2892-8

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