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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 7/2015

01.07.2015 | Review

Present status of Sn–Zn lead-free solders bearing alloying elements

verfasst von: Shuang Liu, Song-bai Xue, Peng Xue, Dong-xue Luo

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 7/2015

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Abstract

Recently, the Sn–Zn family of alloys, which possesses many attractive advantages such as relatively low melting point, cheap cost and the environmentally friendly component of Zn, has been widely used in electronic industry as one of the most potential replacements for the traditional Sn–Pb solders. However, there’re still some arguments on its shortcomings about the poor wettability and the weak oxidation resistance, which definitely limits its further application in lead-free electronic manufacturing. In order to overcome these disadvantages and further enhance the properties of Sn–Zn lead-free solders, alloying elements such as RE, Bi, Ag, Al, Ga, Cu, etc. were selected by lots of researchers as alloys addition into the solders. This paper summarizes the effects of alloying elements on the wettability, oxidation resistance, mechanical properties and microstructures of Sn–Zn lead-free solder alloys.
Vorheriger Artikel Progress in bulk cadmium mercury telluride over the last 25 years
Nächster Artikel Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years

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Metadaten
Titel
Present status of Sn–Zn lead-free solders bearing alloying elements
verfasst von
Shuang Liu
Song-bai Xue
Peng Xue
Dong-xue Luo
Publikationsdatum
01.07.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 7/2015
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2659-7

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