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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 14/2017

01.04.2017

Facile synthesis of copper sulfides with different shapes for high-performance supercapacitors

verfasst von: Haihua Hu, Jiqiu Qi, Yanwei Sui, Yaoyao Zhou, Fuxiang Wei, Yezeng He, Qingkun Meng, Zhi Sun, Guoqing Zhang, Ziping Wang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 14/2017

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Abstract

A facile and low-cost strategy has been demonstrated in this paper for the synthesis of copper sulfides with different shapes and chemical compositions via an one-step hydrothermal method. Various CuSs were fabricated through changing the reaction temperature and further systematically characterized by XRD, EDS, SEM, TEM HAADF-STEM and SAED in details (crooked sheets for CuS-140 (Cu7.2S4), nanoparticles for CuS-160 (Cu7.2S4), tentaculiform for CuS-180 (Cu1.81S)). Encouragingly, the obtained samples also respectively display excellent electrochemical performance as electrodes for supercapacitors and CuS-140 shows the highest capacitance of 1000.2 F/g as compared to 725.8 F/g for CuS-160 and 520.1 F/g for CuS-180 at 1 A/g. The capacitance decreases as the current density range from 1 to 5 A/g and CuS-160 decreased by 80.89% at the current density of 5 A/g, indicating excellent rate property. Particularly, the three as-prepared electrodes also reveal excellent cycling stabilities and the specific capacitance still maintains 94.7%, 90.6% and 100% for CuS-140, CuS-160 and CuS-180 after the completion of 1000 cycles. Therefore, this work provides a promising pathway for the fabrication of high-performance electrode materials for SCs.
Vorheriger Artikel Synthesis of Ag/TiO2 core–shell nanowires with enhanced stability of photocatalytic activity
Nächster Artikel Structural and dielectric properties of Pb(1−x)(Na0.5Sm0.5) x TiO3 ceramics

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Metadaten
Titel
Facile synthesis of copper sulfides with different shapes for high-performance supercapacitors
verfasst von
Haihua Hu
Jiqiu Qi
Yanwei Sui
Yaoyao Zhou
Fuxiang Wei
Yezeng He
Qingkun Meng
Zhi Sun
Guoqing Zhang
Ziping Wang
Publikationsdatum
01.04.2017
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 14/2017
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-017-6848-z

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