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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 1/2013

01.01.2013

Influences of ZrO2 nano-particles on the microstructures and microhardness of Sn8Zn1Bi–xZrO2/Cu solder joints

verfasst von: Changfei Peng, Jun Shen, Henggang Yin

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1/2013

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Abstract

ZrO2 nano-particles reinforced Sn8Zn1Bi–xZrO2 (x = 0.25, 0.5 and 1) composite solder balls were prepared by a mechanical mixing method and then they were reflowed on Cu substrates. The influences of ZrO2 nano-particles on the microstructures and microhardness of the composite solder joints was investigated. Zn-rich phase was refined in the SnZnBi–xZrO2 composite solder matrices due to the adsorption of the ZrO2 nano-particles on them. The refined Zn-rich phase increased the microhardness of the composite solder matrices. Furthermore, the adsorption effect of ZrO2 nano-particles to the SnZnBi–xZrO2/Cu interface suppressed the growth of intermetallic compound (IMC) layers by decreasing the growth driving force of them. However, Zn atoms were impeded from gathering on the SnZnBi–xZrO2/Cu interfaces to form Cu5Zn8 phase due to the refinement of Zn-rich phase. Therefore, this gave excessive growth of the Cu6Sn5 IMC layer.
Vorheriger Artikel Preparation and dielectric properties of BaTiO3-based X8R ceramics co-doped with BIT and CBS glass
Nächster Artikel Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect

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Metadaten
Titel
Influences of ZrO2 nano-particles on the microstructures and microhardness of Sn8Zn1Bi–xZrO2/Cu solder joints
verfasst von
Changfei Peng
Jun Shen
Henggang Yin
Publikationsdatum
01.01.2013
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 1/2013
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-012-0711-z

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