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23.10.2017 | Technical Paper

Wafer-level micropackaging in thin film technology for RF MEMS applications

verfasst von: A. Persano, P. Siciliano, F. Quaranta, A. Taurino, A. Lucibello, Romolo Marcelli, G. Capoccia, E. Proietti, A. Bagolini, J. Iannacci

Erschienen in: Microsystem Technologies | Ausgabe 1/2018

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Abstract

In this work, a thin-film packaging was developed to be used for radio-frequency microelectromechanical system configurations. The fabricated packages are suspended membranes in the multilayer Si_xN_y/aSi/Si_xN_y on conductive coplanar waveguides (CPWs) of different length. Several geometric parameters of the membranes, which are the length, the curvature radius at the vertices of the rectangular base, the density and the diameter of holes on the capping surface, were also varied. The mechanical properties of the suspended membranes were investigated by mechanical simulations and surface profilometry measurements as a function of the geometric parameters. RF characterization was performed to evaluate the impact of the package on the CPW performance. Finally, network analysis was carried out, allowing to clarify the origin of the RF losses measured for the fabricated microdevices.

Vorheriger Artikel A novel design of a low-voltage low-loss T-match RF-MEMS capacitive switch

Nächster Artikel Design and analysis of a boosted pierce oscillator using MEMS SAW resonators

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Titel: Wafer-level micropackaging in thin film technology for RF MEMS applications
verfasst von: A. Persano
P. Siciliano
F. Quaranta
A. Taurino
A. Lucibello
Romolo Marcelli
G. Capoccia
E. Proietti
A. Bagolini
J. Iannacci
Publikationsdatum: 23.10.2017
Verlag: Springer Berlin Heidelberg
Erschienen in: Microsystem Technologies / Ausgabe 1/2018
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-017-3583-6

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