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Journal of Materials Science

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25.02.2021 | Electronic materials

Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses

verfasst von: Dongjin Kim, Sangmin Lee, Chuantong Chen, Seung-Joon Lee, Shijo Nagao, Katsuaki Suganuma

Erschienen in: Journal of Materials Science | Ausgabe 16/2021

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Abstract

Ag sinter joining technology is emerging as a die attach material for next-generation power modules in high-temperature applications. Thermal shock test has revealed that the fracture characteristics and reliability of sintered Ag joint were influenced by thermo-mechanical stress. This was study conducted to understand the microstructure, vertical crack formation, and fracture behavior of sintered Ag joints which were designed with different metallization layers on a direct bonded aluminum (DBA) substrate, at different thermo-mechanical stresses during thermal shock tests. Two kinds of metallization layers were designed as Ti/Ag and Ni/Ti/Ag layers. A finite element model (FEM) simulation confirmed that the Ni layer prohibited Al hillock-like deformation and generates different thermo-mechanical stresses during the thermal shock test from − 50 °C to 250 °C. Depending on the degradation of the interfaces for both of the Ag-sintered joints, the sintered Ag grain necking thickness and microstructure characteristics including the Ag grain structures, which have a dominant influence on the bonding strength in terms of long-term reliability, are considerably different from the results by an electron back scatter diffraction (EBSD) analysis. This paper proposes a novel metallization technology that can induce joint fracture with complete recrystallization of sintered Ag joints by effectively suppressing interfacial degradation. The mechanism of this technology was systematically analyzed through experiments and FEM simulations.

Vorheriger Artikel Effects of chromium/fluorine co-doping on the electrochemical performance of Li1.2Ni0.13Co0.13Mn0.54O2 cathode material for lithium-ion batteries

Nächster Artikel Enhancement of nonlinear optical property of Cu2O/Ag/Cu2O composite films induced by laser irradiation

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Titel: Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses
verfasst von: Dongjin Kim
Sangmin Lee
Chuantong Chen
Seung-Joon Lee
Shijo Nagao
Katsuaki Suganuma
Publikationsdatum: 25.02.2021
Verlag: Springer US
Erschienen in: Journal of Materials Science / Ausgabe 16/2021
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI: https://doi.org/10.1007/s10853-021-05924-z

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