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Erschienen in: Journal of Electronic Testing 1/2017

11.01.2017

A Low-Cost Reliability vs. Cost Trade-Off Methodology to Selectively Harden Logic Circuits

verfasst von: I. Wali, B. Deveautour, Arnaud Virazel, A. Bosio, P. Girard, M. Sonza Reorda

Erschienen in: Journal of Electronic Testing | Ausgabe 1/2017

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Abstract

Selecting the ideal trade-off between reliability and cost associated with a fault tolerant architecture generally involves an extensive design space exploration. Employing state-of-the-art reliability estimation methods makes this exploration un-scalable with the design complexity. In this paper we introduce a low-cost reliability analysis methodology that helps taking this key decision with less computational effort and orders of magnitude faster. Based on this methodology we also propose a selective hardening technique using a hybrid fault tolerant architecture that allows meeting the soft-error rate constraints within a given design cost-budget and vice versa. Our experimental validation shows that the methodology offers huge gain (1200 ×) in terms of computational effort in comparison with fault injection-based reliability estimation method and produces results within acceptable error limits.

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Metadaten
Titel
A Low-Cost Reliability vs. Cost Trade-Off Methodology to Selectively Harden Logic Circuits
verfasst von
I. Wali
B. Deveautour
Arnaud Virazel
A. Bosio
P. Girard
M. Sonza Reorda
Publikationsdatum
11.01.2017
Verlag
Springer US
Erschienen in
Journal of Electronic Testing / Ausgabe 1/2017
Print ISSN: 0923-8174
Elektronische ISSN: 1573-0727
DOI
https://doi.org/10.1007/s10836-017-5640-6

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