Ausgabe 7/2008
Inhalt (14 Artikel)
InGaAs/AlGaAs Quantum Dot Nanostructures for 980 nm Operation
G. Trevisi, P. Frigeri, M. Minelli, S. Franchi
Fabrication of Thick Germanium-on-Insulator (GeOI) Substrates
S. Balakumar, K.M. Hoe, G.Q. Lo, R. Kumar, N. Balasubramanian, Y.L. Foo, S. Tripathy, D.L. Kwong
Electrically Conductive Metal Polymer Nanocomposites for Electronics Applications
Mikko Karttunen, Pekka Ruuskanen, Ville Pitkänen, Willem M. Albers
Properties and Microstructures of Low-Temperature-Processable Ultralow-Dielectric Porous Polyimide Films
Yuxing Ren, David C.C. Lam
Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration
S.W. Liang, Y.W. Chang, Chih Chen, Jackie Preciado, K.N. Tu
Determination of the Elastic Properties of Au5Sn and AuSn from Ab Initio Calculations
Rong An, Chunqing Wang, Yanhong Tian
Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls
Yang Yu, Zhidong Xia, Fu Guo, Yaowu Shi
Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy
Wenxing Dong, Yaowu Shi, Zhidong Xia, Yongping Lei, Fu Guo
Phase Equilibria of the Sn-Sb Binary System
Sinn-Wen Chen, Chih-Chi Chen, Wojcieh Gierlotka, An-Ren Zi, Po-Yin Chen, Hsin-Jay Wu
Effect of Strain Rate and Temperature on the Tensile Properties of Tin-Based Lead-Free Solder Alloys
Ning Bai, Xu Chen, Zhou Fang
Interface-Charge-Coupled Polarization Response of Pt-BaTiO3-ZnO-Pt Heterojunctions: A Physical Model Approach
Venkata M. Voora, T. Hofmann, M. Brandt, M. Lorenz, M. Grundmann, N. Ashkenov, M. Schubert