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Erschienen in: Microsystem Technologies 7/2018

12.03.2018 | Technical Paper

Thermal performance optimization of Si micro flat heat pipes by Box–Behnken design

verfasst von: Mohammad Hamidnia, Yi Luo, Xiaodong Wang, Gang Jing

Erschienen in: Microsystem Technologies | Ausgabe 7/2018

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Abstract

Si micro heat pipe (MHP) is become an excellent passive cooling device for thermal management of micro electronics packages because of its considerable thermo-mechanical matching and fabrication feasibility with micro machining methods. The structural and operational parameters have nonlinear relationship which effect on thermal performance of MHP. In this experimental study, three different Si MHPs with same dimensions and hydraulic diameter of 120 μm, and various cross-sections are fabricated by micro fabrication methods and tested under different conditions of fluid charge ratios and input powers. To obtain optimal condition among effective input variables of fluid ratio, input power and cross-section’s shape, statistical method of Box–Behnken design (BBD) from response surface method family is used and experiments are performed according to BBD. Comparison between experiments and optimized model, demonstrated BBD method can establish acceptable relationship between effective input/output parameters, without solving the nonlinear and complex equations. Both theoretical and experimental methods confirmed that the trapezoidal MHP associated with rectangular artery which was charged with 40% of its vapor chamber’s volume had the best thermal performance.

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Metadaten
Titel
Thermal performance optimization of Si micro flat heat pipes by Box–Behnken design
verfasst von
Mohammad Hamidnia
Yi Luo
Xiaodong Wang
Gang Jing
Publikationsdatum
12.03.2018
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 7/2018
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-018-3829-y

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