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Erschienen in: Microsystem Technologies 7/2007

01.04.2007 | Technical Paper

3D-feature-based structure design for silicon fabrication of micro devices

verfasst von: Yang Liu, Pingyu Jiang, Dinghong Zhang, Guanghui Zhou

Erschienen in: Microsystem Technologies | Ausgabe 7/2007

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Abstract

To make MEMS structure design in a more intuitive way, and to support the “function to 3D shape to mask” design flow, a 3D feature based structure design framework and its corresponding key enabling techniques are presented on the basis of inverse design processes and top-down design methodologies. Driven by space mapping among function and structure, the feature model and its parameters are restricted with the bond graph represented simulation model, which is constructed with functional components in simulation library at the system-level. Conforming design rules, the hierarchic feature information model is established and finally can be cascaded down to a group of 3D feature nodes, which are all silicon fabrication oriented and defined on the top of CSG/B-rep 3D solid models. Surrounding this feature information model, the 2D mask deducing and fabrication parameters extraction at the fabrication-level can be performed for manufacturability checking, design/fabrication conflict feedback and fabrication process sequence generation. Taking a micro gap-closing actuator as an example, the structure design process is demonstrated in terms of this 3D feature modeling methodology.

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Metadaten
Titel
3D-feature-based structure design for silicon fabrication of micro devices
verfasst von
Yang Liu
Pingyu Jiang
Dinghong Zhang
Guanghui Zhou
Publikationsdatum
01.04.2007
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 7/2007
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-006-0371-0

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