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Journal of Materials Engineering and Performance
Erschienen in: Journal of Materials Engineering and Performance 5/2020

13.05.2020

Effect of Doped Nano-Ni on Microstructure Evolution and Mechanical Behavior of Sn-3.0Ag-0.5Cu (SAC305)/Cu-2.0Be Solder Joint during Isothermal Aging

verfasst von: Zuozhu Yin, Mei Lin, Yongde Huang, Yuhua Chen, Qi Li, Ziyuan Wu

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 5/2020

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Abstract

The Cu-2.0Be alloy is widely used as the substrate in the aircraft electronic device, which has a potential trend to replace the pure Cu substrate. However, few studies have investigated the influence of the doped Ni nanoparticles on interfacial reaction between Cu-2.0Be substrate and the SAC305 solder during isothermal aging. In this study, the effect of doped nano-Ni on microstructure evolution and mechanical behavior of Sn-3.0Ag-0.5Cu (SAC305)/Cu-2.0Be solder joint during isothermal aging was studied. The result showed that the intermetallic compounds (IMCs) thickness of SAC305/Cu-2.0Be solder joint was thicker than that of SAC305-0.1Ni/Cu-2.0Be solder joint, which indicated that the composite solder’s growth rate was smaller than that of monolithic solder. Furthermore, the SAC305-0.1Ni also had a smaller diffusion coefficient (1.65 × 10−12 μm2/s) than that of SAC305 (2.72 × 10−12 μm2/s). The SAC305-0.1Ni/Cu-2.0Be solder joint showed better mechanical property than that of SAC305/Cu-2.0Be solder joint. It indicated that a trace amount of Ni nanoparticle could hinder interfacial IMC layer’s growth effectively. Therefore, SAC305-0.1Ni solder alloy is a promising potential solder alloy in electronic packaging field.
Vorheriger Artikel Wear-Resistant Carbon-Fiber-Reinforced Ti-Based Composite Obtained by Laser Metal Deposition
Nächster Artikel Effect of N2/TMS Gas Ratio on Mechanical and Erosion Performances of Ti-Si-C-N Nanocomposite Coatings

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Metadaten
Titel
Effect of Doped Nano-Ni on Microstructure Evolution and Mechanical Behavior of Sn-3.0Ag-0.5Cu (SAC305)/Cu-2.0Be Solder Joint during Isothermal Aging
verfasst von
Zuozhu Yin
Mei Lin
Yongde Huang
Yuhua Chen
Qi Li
Ziyuan Wu
Publikationsdatum
13.05.2020
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 5/2020
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-020-04838-2

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