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Microsystem Technologies
Erschienen in: Microsystem Technologies 1/2008

01.01.2008 | Technical Paper

Evaluation of eutectic bond strength and assembly of Al-based microfluidic structures

verfasst von: Fanghua Mei, J. Jiang, W. J. Meng

Erschienen in: Microsystem Technologies | Ausgabe 1/2008

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Abstract

Metal-based microscale heat exchangers have potential advantages over similar Si-based devices. Bonding and assembly are critical for building functional metal-based microfluidic devices from metallic high-aspect-ratio microscale structures (HARMS). In this paper, we report eutectic bonding of Al specimens with Al–Ge thin film intermediate layers. Quantitative evaluation of bond strengths was carried out as a function of various bonding parameters, including bonding temperature, applied pressure, and Al–Ge intermediate layer thickness. With this eutectic bonding strategy, successful assembly of multilayered Al microfluidic structures is demonstrated.
Vorheriger Artikel Design and simulation of a novel bridge-like coplanar waveguide for microelectromechanical systems
Nächster Artikel An on-chip micro-friction tester for tribology research of silicon based MEMS devices

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Metadaten
Titel
Evaluation of eutectic bond strength and assembly of Al-based microfluidic structures
verfasst von
Fanghua Mei
J. Jiang
W. J. Meng
Publikationsdatum
01.01.2008
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 1/2008
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-007-0407-0

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