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Journal of Materials Science: Materials in Electronics

Erschienen in:

02.01.2019

Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices

verfasst von: Fuwen Yu, Hongtao Chen, Chunjin Hang, Mingyu Li

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 4/2019

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Abstract

This paper presents a fabrication method for high-temperature-resistant bondlines based on Cu@Ag@Sn multilayer core–shell hybrid microspheres in which a Ag layer was adopted to accelerate the consumption of a Sn layer. The phase transformation and microstructural evolution during the bonding process were investigated in detail. After the microspheres were heated at 250 °C for 20 min under a pressure of 0.5 MPa, the bondline could withstand high operation temperatures of up to 480 °C. After reflowing at 250 °C for just 5 min, the outer low-melting-point Sn layer was completely consumed. After 20 min, the bondline was composed of Ag₃Sn and Cu₃Sn intermetallic compounds with a dispersion of Cu microspheres. The average shear strengths of the resulting bondlines were 39.9 and 31.9 MPa at room temperature and at 400 °C, respectively.

Vorheriger Artikel Enhanced electrical and fatigue properties of La-modified (100)-oriented PZT thin films with various Zr/Ti ratio

Nächster Artikel Thermal stability improvement and crystallization behavior of Ag doped Ge2Sb2Te5 phase change materials

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A. Drevin-Bazin, F. Lacroix, J.F. Barbot, SiC die attach for high-temperature applications. J. Electron. Mater. 43, 695–701 (2014)CrossRef

Y. Zhong, R. An, C. Wang, Z. Zheng, Z.Q. Liu, C.H. Liu et al., Low temperature sintering Cu₆Sn₅ nanoparticles for superplastic and super-uniform high temperature circuit interconnections. Small 11, 4097–4103 (2015)CrossRef

Y. Mikamura, K. Hiratsuka, T. Tsuno, H. Michikoshi et al., Novel designed SiC devices for high power and high efficiency systems. IEEE Trans. Electron Devices 62, 382–389 (2015)CrossRef

H.S. Chin, K.Y. Cheong, A.B. Ismail, A review on die attach materials for SiC-based high-temperature power devices. Metall. Mater. Trans. B 41, 824–832 (2010)CrossRef

J. Li, X. Li, L. Wang, Y.H. Mei, G.Q. Lu, A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air. Mater. Des. 140, 64–72 (2018)CrossRef

K.S. Siow, Mechanical properties of nano-silver joints as die attach materials. J. Alloys Compd. 514, 6–19 (2012)CrossRef

S.T. Chua, K.S. Siow, Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C. J. Alloys Compd. 687, 486–498 (2016)CrossRef

S.A. Paknejad, S.H. Mannan, Review of silver nanoparticle based die attach materials for high power/temperature applications. Microelectron. Reliab. 70, 1–11 (2017)CrossRef

J.F. Li, P.A. Agyakwa, C.M. Johnson, Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process. Acta Mater. 59, 1198–1211 (2011)CrossRef

10.

J.F. Li, P.A. Agyakwa, C.M. Johnson, Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment. J. Electron. Mater. 43, 983–995 (2014)CrossRef

11.

J. Liu, H. Zhao, Z. Li, X. Song et al., Microstructure evolution, grain morphology variation and mechanical property change of Cu–Sn intermetallic joints subjected to high-temperature aging. Mater. Charact. 135, 238–244 (2018)CrossRef

12.

H. Shao, A. Wu, Y. Bao, Y. Zhao, Elimination of pores in Ag-Sn TLP bonds by the introduction of dissimilar intermetallic phases. J. Mater. Sci. 52, 3508–3519 (2017)CrossRef

13.

J. Wu, C.C. Lee, Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics. J. Mater. Sci. 53, 2618–2630 (2018)CrossRef

14.

H. Chen, T. Hu, M. Li, Z. Zhao, Cu@ Sn core-shell structure powder preform for high-temperature applications based on transient liquid phase bonding. IEEE Trans. on Power Electron. 32, 441–451 (2017)CrossRef

15.

T. Hu, H. Chen, M. Li, C. Wang, Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions. Mater. Des. 131, 196–203 (2017)CrossRef

16.

F. Yu, B. Wang, Q. Guo, X. Ma, M. Li, H. Chen, Ag@ Sn core-shell powder preform with a high re-melting temperature for high-temperature power devices packaging. Adv. Eng. Mater. 20, 1700524 (2018)CrossRef

17.

X. Liu, S. He, H. Nishikawa, Thermally stable Cu₃Sn/Cu composite joint for high-temperature power device. Scripta Mater. 110, 101–104 (2016)CrossRef

18.

X. Deng, N. Chawla, K.K. Chawla, M. Koopman, Deformation behavior of (Cu, Ag)-Sn intermetallics by nanoindentation. Acta Mater. 52, 4291–4303 (2004)CrossRef

19.

X. Deng, M. Koopman, N. Chawla, K.K. Chawla, Young’s modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation. Mater. Sci. Eng. A 364, 240–243 (2004)CrossRef

20.

P.J. Rossi, N. Zotov, E. Bischoff, E.J. Mittemeijer, Dependence of intermetallic compound formation on the sublayer stacking sequence in Ag-Sn bilayer thin films. Acta Mater. 103, 174–183 (2016)CrossRef

21.

A.M. Gusak, K.N. Tu, Kinetic theory of flux-driven ripening. Phys. Rev. B 66, 115403 (2002)CrossRef

22.

H. Okamoto, Desk Handbook Phase Diagrams for Binary Alloys (ASM International, Ohio, 2000)

23.

J.F. Li, P.A. Agyakwa, C.M. Johnson, Kinetics of Ag₃Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process. Acta Mater. 58, 3429–3443 (2010)CrossRef

24.

B.S. Lee, J.W. Yoon, Cu-Sn intermetallic compound joints for high-temperature power electronics applications. J. Electron. Mater. 47, 430–435 (2018)CrossRef

25.

K. Zeng, R. Stierman, T. Chiu, D. Edwards et al., Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. J. Appl. Phys. 97, 024508 (2005)CrossRef

26.

C.Y. Liu, J.T. Chen, Y.C. Chuang, L. Ke, S.J. Wang, Electromigration-induced Kirkendall voids at the Cu/Cu₃Sn interface in flip-chip Cu/Sn/Cu joints. Appl. Phys. Lett. 90, 112114 (2007)CrossRef

27.

H. Shao, A. Wu, Y. Bao, Y. Zhao, G. Zou, Microstructure characterization and mechanical behavior for Ag₃Sn joint produced by foil-based TLP bonding in air atmosphere. Mater. Sci. Eng. A 680, 221–231 (2017)CrossRef

28.

X. Liu, S. He, H. Nishikawa, Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach. J. Alloys Compd. 695, 2165–2172 (2017)CrossRef

29.

F. Guo, J.P. Lucas, K.N. Subramanian, Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5 Ag and Sn-4.0Ag-0.5Cu non-composite solder joints. J. Mater. Sci.: Mater. Electron. 12, 27–35 (2001)

Titel: Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices
verfasst von: Fuwen Yu
Hongtao Chen
Chunjin Hang
Mingyu Li
Publikationsdatum: 02.01.2019
Verlag: Springer US
Erschienen in: Journal of Materials Science: Materials in Electronics / Ausgabe 4/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-018-00637-7

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