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02.04.2016 | Technical Paper

PMMA microfluidic chip fabrication using laser ablation and low temperature bonding with OCA film and LOCA

verfasst von: Kan Liu, Jianzhen Xiang, Zhao Ai, Shoukun Zhang, Yi Fang, Ting Chen, Qiongwei Zhou, Songzhan Li, Shengxiang Wang, Nangang Zhang

Erschienen in: Microsystem Technologies | Ausgabe 6/2017

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Abstract

A new PMMA microfluidic chip fabrication method by combining laser ablation technology with low-temperature bonding using optically clear adhesive (OCA) film and liquid optically clear adhesive (LOCA) was presented in this paper. The deformation and clogging issues of the microfluidic channel were well solved. The effective bonding area ratio of microfluidic chips could be greatly improved by adjusting bonding temperature and bonding time. The crevices around the microchannels were effectively eliminated by coating treatment of LOCA. The bonding strength and waterproof of PMMA microfluidic chips coating with/without LOCA were also evaluated in this paper.

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Titel: PMMA microfluidic chip fabrication using laser ablation and low temperature bonding with OCA film and LOCA
verfasst von: Kan Liu
Jianzhen Xiang
Zhao Ai
Shoukun Zhang
Yi Fang
Ting Chen
Qiongwei Zhou
Songzhan Li
Shengxiang Wang
Nangang Zhang
Publikationsdatum: 02.04.2016
Verlag: Springer Berlin Heidelberg
Erschienen in: Microsystem Technologies / Ausgabe 6/2017
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-016-2924-1

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