Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries

The microstructural evolution and bonding behavior of transient liquid phase (TLP) bonded joints for single-crystal superalloy samples with a 300-μm-wide gap have been investigated. The results show that at the initial stage, the interface grows with a cellular structure. With the increase of time, the length and numbers of the cellular structures decrease. At the final stage, the interface evolves with a planar manner. The gradient of B ahead of the liquid/solid interface exists and becomes sharper from the initial to the final analyzed from the electron probe microanalysis (EPMA) results. Inevitably, isolated grain forms during the evolution of the interface and the growth rate of isothermal solidification zone (ISZ) changes through the whole bonding process, and these both deviate from the traditional TLP bonding models. The mechanisms of the formation of the isolated grain boundaries and the reasons for the deviation of the solidification rate are discussed. Also, some effective methods to avoid the formation of isolated grain boundaries in the ISZ are proposed.