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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 15/2018

09.06.2018

Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

verfasst von: Yang Liu, Shengli Li, Hao Zhang, Hongming Cai, Fenglian Sun, Guoqi Zhang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 15/2018

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Abstract

This study investigated the interfacial reaction, the microstructure, and the hardness of the SAC305-xNi solder on both Cu and graphene-coated Cu (G–Cu) substrates. The experimental results indicate that the increase of Ni content in the solder leads to the roughness of the (Cu, Ni)6Sn5 IMC layer on Cu. In contrast, the growth of the (Cu, Ni)6Sn5 interfacial IMC, which results from increasing Ni addition, is significantly suppressed on G–Cu substrates. As the concentration of Ni ranges from 0 to 0.2 wt%, the microstructure of the solder bulks on Cu substrates shows slight changes. The hardness of the solder bulks in SAC305-Ni/Cu is similar to that in the SAC305/Cu solder joint. The amount of β-Sn rises and the eutectic area shrinks due to increasing Ni addition in the solder bulks on G–Cu substrates. Therefore, the solder bulks in the SAC305-Ni/G–Cu show lower hardness than that in the SAC305/G–Cu solder joint.
Vorheriger Artikel High quality transparent conductive hydrogenated AZO with embedded Ag films deposited on PEN flexible substrate
Nächster Artikel Investigation of magnetic response of charge ordering in half-doped La0.5Ca0.5MnO3 manganite

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Metadaten
Titel
Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
verfasst von
Yang Liu
Shengli Li
Hao Zhang
Hongming Cai
Fenglian Sun
Guoqi Zhang
Publikationsdatum
09.06.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 15/2018
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9440-2

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