Ausgabe 4/2013
Inhalt (18 Artikel)
Process development of a novel wafer level packaging with TSV applied in high-frequency range transmission
- Review Paper
Xiao Chen, Jiajie Tang, Gaowei Xu, Le Luo
Investigations into mixing of fluids in microchannels with lateral obstructions
- Technical Paper
Pankaj Kumar Sahu, Aakash Golia, Ashis Kumar Sen
An analytical study of the effect of a support geometry on frequency shift and support loss of piezoelectric ring-shaped resonators for healthcare and environmental applications
- Technical Paper
Dong F. Wang, Takahisa Sagawa, Jian Lu, Ryutaro Maeda
Electroplated nickel based micro-machined disk resonators for high frequency applications
- Technical Paper
Ritesh Ray Chaudhuri, Tarun K. Bhattacharyya
Fabrication of TiN-based three-terminal nano mechanical relays using nanoimprint technology
- Technical Paper
Y. J. Chang, D. Y. Liu, C. L. Kuo
Mechanical strengthening of Si cantilevers by chemical wet etching
- Technical Paper
Mitsuhiro Shikida, Tatsuya Hasegawa, Kayo Hamaguchi, Kazuo Sato
Surface state defining factors as key to the strength of ceramic micro parts
- Technical Paper
Marcus Müller, Fatih A. Çetinel, Joachim Rögner, Werner Bauer, Regina Knitter
Optimization of design and characterization of a novel micro-pumping system with peristaltic motion
- Technical Paper
Rishi Kant, Himanshu Singh, Monalisha Nayak, Shantanu Bhattacharya
A water-immersible 2-axis scanning mirror microsystem for ultrasound andha photoacoustic microscopic imaging applications
- Technical Paper
Chih-Hsien Huang, Junjie Yao, Lihong V. Wang, Jun Zou
An analytical coupling coefficient for MEMS tunable silicon nanowire waveguide coupler devices
- Technical Paper
Y. Akihama, K. Hane
A low power micro fluxgate sensor with improved magnetic core
- Technical Paper
Chong Lei, Jian Lei, Zhen Yang, Tao Wang, Yong Zhou
Immersion effect of fluoride liquid into cavities of negative mold in thermal imprint
- Technical Paper
Harutaka Mekaru, Hiroshi Hiroshima
Using silicon molds for ultrasonic embossing on Polymethyl Methacrylate (PMMA) substrates
- Technical Paper
Na Qi, Yi Luo, Xu Yan, Xiaodong Wang, Liding Wang
Characterization of out-of-plane cone metal microneedles and the function of transdermal delivery
- Technical Paper
Jun Zhu, Qi Shen, Ying Cao, Hong Wang, Xiang Chen, Di Chen
Generating different profiles of gradient concentrations inside a gel-filled chamber: design and simulation
- Technical Paper
Masoomeh Tehranirokh, Abbas Z. Kouzani, Paul S. Francis, Jagat R. Kanwar
Hot embossing of polymer nanochannels using PMMA moulds
- Technical Paper
Junshan Liu, Xingxing Jin, Tuo Sun, Zheng Xu, Chong Liu, Jian Wang, Li Chen, Liding Wang
Impact of alcohol additives concentration on etch rate and surface morphology of (100) and (110) Si substrates etched in KOH solutions
- Open Access
- Technical Paper
Krzysztof P. Rola, Irena Zubel
