Special issue on WaferBond‘11

Excerpt

WaferBond‘11, the International Conference on Wafer Bonding for MEMS technologies and Wafer level integration took place in Chemnitz, Germany organized by an international Organizing Committee and hosted by Fraunhofer ENAS from 6th–8th December 2011. It was the fifth event in a row and attracted about 100 researchers from science and industry. The attendees came from over 15 countries worldwide, e.g. USA, Japan, China, and almost ten European countries. From 49 contributions, 27 oral presentations and 15 posters were shown. Every session was introduced by an excellent keynote presentation, held by experts on the field of wafer bonding e.g. Kevin Turner (University of Pennsylvania, USA), Tatadomo Suga (University of Tokyo, Japan), Holger Rank (Bosch, Germany), and Michael Despont (IBM, Switzerland). The presentations and posters covered the following issues: direct silicon bonding at low and high temperatures, metal to metal thermo-compressive bonding (with and without solder), glass frit bonding or adhesive bonding and issues like integration of wafer bonding into industrial fabrication processes for MEMS, reliability tests, 3D-Integration, wafer bonding equipment, markets and trends. …