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Erschienen in: Microsystem Technologies 5-6/2007

01.03.2007 | Technical paper

Study on the method for the reliability test of focused ion beam

verfasst von: Sang H. Lee, Hyun-Wook Kang, Dong-Woo Cho, Wonkyu Moon

Erschienen in: Microsystem Technologies | Ausgabe 5-6/2007

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Abstract

We investigate the reliability of the focused ion beam (FIB) system with the designed evaluation patterns. The reliability test patterns are composed of three parts, which are the ion beam quality patterns, the ion beam scanning ability patterns and the stage system patterns. The designed patterns are fabricated with the commercial FIB system, and the common nanometer scale measurement systems, the atomic force microscopy and the scanning electron microscopy are used to evaluate the fabricated patterns. The measurement of the absolute length becomes important in the reliability test, and the measurement systems are calibrated with the standard patterns. The measurement results show the proposed patterns are suitable to measure the characteristics of FIB system and also other machines which can fabricate nanometer scale and high-aspect-ratio patterns.

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Literatur
Zurück zum Zitat Fu YQ, Bryan NKA, Shing ON, Wyan HNP (2000) Influence analysis of dwell time on focused ion beam micromachining in silicon. Sens Actuators A 79:230–234CrossRef Fu YQ, Bryan NKA, Shing ON, Wyan HNP (2000) Influence analysis of dwell time on focused ion beam micromachining in silicon. Sens Actuators A 79:230–234CrossRef
Zurück zum Zitat Fujita J, Ishida M, Ichihashi T, Ochiai Y, Kaito T, Matsui S (2003) Growth of three-dimensional nano-structures using FIB-CVD and its mechanical properties. Nucl Instrum Methods Phys Res B 206:472–477CrossRef Fujita J, Ishida M, Ichihashi T, Ochiai Y, Kaito T, Matsui S (2003) Growth of three-dimensional nano-structures using FIB-CVD and its mechanical properties. Nucl Instrum Methods Phys Res B 206:472–477CrossRef
Zurück zum Zitat Gierak J, Septier A, Vieu C (1999) Design and realization of a very high-resolution FIB nanofabrication instrument. Nucl Instrum Methods Phys Res A 427:91–98CrossRef Gierak J, Septier A, Vieu C (1999) Design and realization of a very high-resolution FIB nanofabrication instrument. Nucl Instrum Methods Phys Res A 427:91–98CrossRef
Zurück zum Zitat Inkson BJ, Mulvihill M, Möbus G (2001) 3D determination of grain shape in a FEAl-based nanocomposite by 3D FIB tomography. Scripta Mater 45:753–758CrossRef Inkson BJ, Mulvihill M, Möbus G (2001) 3D determination of grain shape in a FEAl-based nanocomposite by 3D FIB tomography. Scripta Mater 45:753–758CrossRef
Zurück zum Zitat Kang KJ, Yao N, He MY, Evans AG (2003) A method for in situ measurement of the residual stress in thin films by using the focused ion beam. Thin Solid Films 443:71–77CrossRef Kang KJ, Yao N, He MY, Evans AG (2003) A method for in situ measurement of the residual stress in thin films by using the focused ion beam. Thin Solid Films 443:71–77CrossRef
Zurück zum Zitat Lee SH, Kang H-W, Cho D-W, Moon W, (2005) Study on the method for the reliability test of Focused Ion Beam. In: Tech Dig HARMST 2005, Kyungju, Korea (ROK):221–222 Lee SH, Kang H-W, Cho D-W, Moon W, (2005) Study on the method for the reliability test of Focused Ion Beam. In: Tech Dig HARMST 2005, Kyungju, Korea (ROK):221–222
Zurück zum Zitat Li H-W, Kang D-J, Blamire MG, Huck WTS (2003) FIB fabrication of silicon print master for nanocontact printing. Nanotechnology 14:220–223CrossRef Li H-W, Kang D-J, Blamire MG, Huck WTS (2003) FIB fabrication of silicon print master for nanocontact printing. Nanotechnology 14:220–223CrossRef
Zurück zum Zitat Lipp S, Frey L, Lehrer C, Frank B, Demm E, Ryssei H (1999) Investigations on the topology of structures milled and etched by focused ion beams. J Vac Sci Technol B 14(6):3996–3999CrossRef Lipp S, Frey L, Lehrer C, Frank B, Demm E, Ryssei H (1999) Investigations on the topology of structures milled and etched by focused ion beams. J Vac Sci Technol B 14(6):3996–3999CrossRef
Zurück zum Zitat Phaneuf MW (1999) Applications of focused ion beam microscopy to materials science specimens. Micron 30:277–288CrossRef Phaneuf MW (1999) Applications of focused ion beam microscopy to materials science specimens. Micron 30:277–288CrossRef
Zurück zum Zitat Xie DZ, Ngoi BKA, Ong AS, Fu YQ, Lim BH (2003) Focused ion beam micromachining of TiNi film on Si(111). Nucl Instrum Methods Phys Res B 211:363–368CrossRef Xie DZ, Ngoi BKA, Ong AS, Fu YQ, Lim BH (2003) Focused ion beam micromachining of TiNi film on Si(111). Nucl Instrum Methods Phys Res B 211:363–368CrossRef
Metadaten
Titel
Study on the method for the reliability test of focused ion beam
verfasst von
Sang H. Lee
Hyun-Wook Kang
Dong-Woo Cho
Wonkyu Moon
Publikationsdatum
01.03.2007
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 5-6/2007
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-006-0227-7

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