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Erschienen in: Microsystem Technologies 5/2013

01.05.2013 | Technical Paper

A novel movable electrode for realizing deep sub-micrometer gap in SOI-based MEMS square resonator

verfasst von: J. W. Jiang, J. F. Bao, Y. J. Du, C. Deng

Erschienen in: Microsystem Technologies | Ausgabe 5/2013

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Abstract

A novel movable electrode is demonstrated to realize deep sub-micrometer resonator-to-electrode gap. This design is based on SOI progress for better reducing the motional impedance. The movable structure contains two main beams, which can be actuated by DC voltage to realize lock-up. After the lock-up process, the DC voltage could be released, so this lock-up progress only needs to be implemented once and can be accomplished before encapsulation. The DC bias voltage for the resonator is thus reduced for better application. In order to examine the improvement of motional impedance using this structure, a 70 MHz lame-mode square resonator is employed in this study. The resonator-to-electrode gap is reduced from 1.05 μm to 50 nm, thus brings about a 280 Ω motional impedance, which is 157,000× smaller than that before the actuation of the movable structure. In addition, the capability to be realized in conventional SOI progress facilitates the fabrication process as well as the realization of high yield.

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Literatur
Zurück zum Zitat Abdolvand R, Ayazi F (2008) An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon. Sens Actuator A 144:109–116CrossRef Abdolvand R, Ayazi F (2008) An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon. Sens Actuator A 144:109–116CrossRef
Zurück zum Zitat Akgul M, Kim BS, Hung LW et al. (2009) Oscillator far-from-carrier phase noise reduction via nano-scale gap tuning of micromechanical resonators. In: Solid-State Sensors, Actuators and Microsystems Conference, Denver, pp 708–711 Akgul M, Kim BS, Hung LW et al. (2009) Oscillator far-from-carrier phase noise reduction via nano-scale gap tuning of micromechanical resonators. In: Solid-State Sensors, Actuators and Microsystems Conference, Denver, pp 708–711
Zurück zum Zitat Chen KL, Wang S, Salvia JC, Melamud R, Howe RT, Kenny TW (2011) Wafer-level epitaxial silican packaging for out-of-plane RF MEMS resonator with integrated actuation electrodes. IEEE Trans Compon, Packag Manuf Technol 1(3):310–317CrossRef Chen KL, Wang S, Salvia JC, Melamud R, Howe RT, Kenny TW (2011) Wafer-level epitaxial silican packaging for out-of-plane RF MEMS resonator with integrated actuation electrodes. IEEE Trans Compon, Packag Manuf Technol 1(3):310–317CrossRef
Zurück zum Zitat Chen WC, Fang WL, Li SS (2012) High-Q integrated CMOS-MEMS resonators with deep-submicrometer gap and quasi-linear frequency tuning. J Microelectromech Syst 21(3):1057–7157 Chen WC, Fang WL, Li SS (2012) High-Q integrated CMOS-MEMS resonators with deep-submicrometer gap and quasi-linear frequency tuning. J Microelectromech Syst 21(3):1057–7157
Zurück zum Zitat Cheng TJ, Bhave SA (2010) High-Q, low impedance polysilicon resonators with 10 nm air gaps. In: 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), Wanchai, Hong Kong, pp 695–698 Cheng TJ, Bhave SA (2010) High-Q, low impedance polysilicon resonators with 10 nm air gaps. In: 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), Wanchai, Hong Kong, pp 695–698
Zurück zum Zitat Demirci MU, Abdelmoneum MA, Nguyen CTC (2003) Mechanically corner-coupled square microresonator array for reduced series motional resistance. In: The 12th International Conference on Solid-State Sensors and Actuators (Transducers’ 03), Boston, Massachussets, pp 955–958. Demirci MU, Abdelmoneum MA, Nguyen CTC (2003) Mechanically corner-coupled square microresonator array for reduced series motional resistance. In: The 12th International Conference on Solid-State Sensors and Actuators (Transducers’ 03), Boston, Massachussets, pp 955–958.
Zurück zum Zitat Lo CC, Chen F, Fedder GK (2005) Integrated HF CMOS-MEMS square-frame resonators with on-chip electronics and electrothermal narrow gap mechanism. In: The 13th International Conference on Solid-state Sensors, Actuators and Microsystems, vol 2. Seoul, Korea, pp 2074–2077 Lo CC, Chen F, Fedder GK (2005) Integrated HF CMOS-MEMS square-frame resonators with on-chip electronics and electrothermal narrow gap mechanism. In: The 13th International Conference on Solid-state Sensors, Actuators and Microsystems, vol 2. Seoul, Korea, pp 2074–2077
Zurück zum Zitat Pourkamali S, Ayazi F (2004) High frequency capacitive micromechanical resonators with reduced motional resistance using the HARPSS technology. 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Atlanta, USA, pp 147–150 Pourkamali S, Ayazi F (2004) High frequency capacitive micromechanical resonators with reduced motional resistance using the HARPSS technology. 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Atlanta, USA, pp 147–150
Zurück zum Zitat Rebeiz GM (2003) RF MEMS: theory, design, and technology. Wiley, HobokenCrossRef Rebeiz GM (2003) RF MEMS: theory, design, and technology. Wiley, HobokenCrossRef
Zurück zum Zitat Strong FW, Skinner JL, Dentinger PM, Tien NC (2006) Electrical breakdown across micro scale gaps in MEMS structures. Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS, San Jose, CA. (V6111) Strong FW, Skinner JL, Dentinger PM, Tien NC (2006) Electrical breakdown across micro scale gaps in MEMS structures. Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS, San Jose, CA. (V6111)
Zurück zum Zitat Wang J, Ren ZY, Nguyen CTC (2003) 1.14-GHz Self-aligned vibrating micromechanical disk resonator. In: IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers, Philadelphia, PA, USA, pp 335–338 Wang J, Ren ZY, Nguyen CTC (2003) 1.14-GHz Self-aligned vibrating micromechanical disk resonator. In: IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers, Philadelphia, PA, USA, pp 335–338
Zurück zum Zitat Wang J, Ren ZY, Nguyen CTC (2004) 1.156-GHz self-aligned vibrating micromechanical disk resonator. IEEE Trans Ultrason Ferroelectr Freq Control 51(12):1607–1628CrossRef Wang J, Ren ZY, Nguyen CTC (2004) 1.156-GHz self-aligned vibrating micromechanical disk resonator. IEEE Trans Ultrason Ferroelectr Freq Control 51(12):1607–1628CrossRef
Zurück zum Zitat Weinstein D, Bhave SA, Morita S, Mitarai S, Ikeda K (2009) Frequency scaling and transducer efficiency in internal dielectrically transduced silicon bar resonators. In: Solid-State Sensors, Actuators and Microsystems Conference, Denver, pp 708–711 Weinstein D, Bhave SA, Morita S, Mitarai S, Ikeda K (2009) Frequency scaling and transducer efficiency in internal dielectrically transduced silicon bar resonators. In: Solid-State Sensors, Actuators and Microsystems Conference, Denver, pp 708–711
Zurück zum Zitat Young WC, Budynas RG (2002) Roark’s formulas for stress and strain. McGraw-Hill, USA Young WC, Budynas RG (2002) Roark’s formulas for stress and strain. McGraw-Hill, USA
Metadaten
Titel
A novel movable electrode for realizing deep sub-micrometer gap in SOI-based MEMS square resonator
verfasst von
J. W. Jiang
J. F. Bao
Y. J. Du
C. Deng
Publikationsdatum
01.05.2013
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 5/2013
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-012-1683-x

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