Ausgabe 4/2008
Inhalt (19 Artikel)
Dependence of Cu/In ratio of structural and electrical characterization of CuInS2 crystal
K. Yoshino, K. Nomoto, A. Kinoshita, T. Ikari, Y. Akaki, T. Yoshitake
Raman scattering studies of ultrashallow Sb implants in strained Si
L. O’Reilly, N. S. Bennett, P. J. McNally, B. J. Sealy, N. E. B. Cowern, A. Lankinen, T. O. Tuomi
Modified thermoelectric figure of merit estimated from enhanced mobility of [100] oriented beta-FeSi2 thin film
Hirofumi Kakemoto, Tohru Higuchi, Hajime Shibata, Satoshi Wada, Takaaki Tsurumi
Synthesis and luminescent characterization of YAl3(BO3)4:Tb3+ phosphors
Zhouyun Ren, Chunyan Tao, Hua Yang
Modeling vacancy injection from the silicon/silicon-nitride interface
Mohammad Hasanuzzaman, Yaser M. Haddara
Microstructure and dielectric properties of BaTiO3-based X7R ceramics
Liying Chen, Shunhua Wu, Shuang Wang, Guoqing Wang
Thermal annealing behaviour on Schottky barrier parameters and structural properties of Au contacts to n-type GaN
K. Jagadeswara Reddy, Varra Rajagopal Reddy, P. Narasimha Reddy
Synthesis and luminescent properties of Sr4Al14O25:Eu2+ blue–green emitting phosphor for white light-emitting diodes (LEDs)
Zhanchao Wu, Jianxin Shi, Jing Wang, Menglian Gong, Qiang Su
Investigation on the synthesis of (Zn1−xMgx)TiO3 and the modulation effect of CaTiO3
Ying Yuan, Shuren Zhang, Xiaohua Zhou, Longcheng Xiang
Creep property of composite solders reinforced by nano-sized particles
Yaowu Shi, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li
PTCR characteristics of semiconducting barium titanate ceramics produced by high-energy ball-milling
K. Park, J.-G. Ha, C.-W. Kim, Jun-Gyu Kim
Thickness dependence of refractive index and optical gap of PMMA layers prepared under electrical field
V. Švorčík, O. Lyutakov, I. Huttel
Dielectric and piezoelectric characterization of PSZT–BT ceramics for capacitor applications
Ramam Koduri, Jose Rodrigo Anfossi Orellana
Microstructure and dielectric properties of BaZr x Ti1−x O3 ceramics
Hongwei Chen, Chuanren Yang, Chunlin Fu, Jun Shi, Jihua Zhang, Wenjian Leng
Size effects in small scaled lead-free solder joints
P. Zimprich, A. Betzwar-Kotas, G. Khatibi, B. Weiss, H. Ipser
Electrical and morphological characterization of polyaniline/sulfonated poly(arylene ether sulfone) composite films
Nurdan D. Sankir, Mehmet Sankir, Richard O. Claus
Thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections under different stress levels
X. P. Zhang, L. M. Yin, C. B. Yu